Nikon Metrology XT V Series

Today there is a growing demand for flexible, highresolution and cost-effective inspection systems to cope with the demands of ever-smaller electrical components and comply with tighter quality standards. With the XT V series, you can get the inside view of printed circuit boards, in a smooth non-destructive process.

The XT V 130 and XT V 160 X-ray inspection systems are flexible high-precision solutions that facilitate defect analysis of loaded PCB boards. Designed for 100% BGA and μBGA inspection, multi-layer board inspection and PCB solder joint inspection, these compact, easy-to-use and cost-effective inspection systems are indispensable in any electronics production area.